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Si Target






















As an important source material of sputtering target, Si is mainly used in plating SiO2 and SiN by the method of magnetron sputtering. Being an important functional coating material, it has good hardness, optical and dielectric properties ,also the characteristics of wear resistant and anticorrosion. Therefore, Si target processes good market prospect in the fields of optics and microelectronics as the functional material which drawn international attention. 
Nowadays, Si is mainly used in LED transparent conductive glass, architectural low-e glass and microelectronics industries.
Silicon target is generally classified into 2 types: Monocrystalline and Polycrystalline.
Resistivity:
0.005-0.02 ohm.cm
                  1-3 ohm.cm
                  >10 ohm.cm

Purity:5N min.,6N min.

Density:2.33g/cm3
Processing Method:CZ; Casting
Specification(max.):

Sheet: L320mm,W100mm,T10mm

Tube:ID135mm,Wall T6/8/10mm,L900mm

Disc: Dia.300mm,T10mm(Monocrystalline)

Dia.450mm,12mm(Polycrystalline)